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Opportunities in Diamond Laser Processing
01 Diamond – The “Best” and Also the “Worst” Material
Diamond is hailed as the "best" material; however, it is also the "worst" for processing. With numerous excellent properties, it is widely used in industries such as optics, electronics, medical, and jewelry, but its processing has always been a tough issue. Whether it's processing efficiency, precision, or cost, diamond is considered the "worst" material to process.
Key Characteristics of Diamond:
Extremely High Hardness: Ideal for cutting tools and surgical blades.
Extremely High Thermal Conductivity: Suitable for high-temperature electronic devices and heat dissipation substrates.
Excellent Irradiation Stability and Chemical Inertness: Used in optical devices and biomedical applications.
Wide Spectrum Transmittance: Applied in optical and microwave devices.
Key Processing Methods for Diamond
Laser Processing of Diamond
The extremely high hardness of diamond makes it an ideal material for cutting tools and surgical blades. However, this also means that traditional machining methods struggle with cutting it. Laser processing emerges as a solution, as the laser's irradiation focuses on the diamond surface, rapidly raising the temperature. High temperatures lead to defective lattice structures, causing a graphite phase change and achieving an ablation cutting effect. Gas assistance is then used to remove the generated slag powder, ensuring the quality of the processing and achieving the desired result.
In various industrial applications, from the core extraction and slicing of MPCVD raw materials, to cutting materials for jewelry, and polishing, cutting, and rough machining of industrial heat dissipation substrates and industrial tools, diamond's presence is ubiquitous. Laser processing gives diamond even more possibilities, especially for workpieces that require complex shapes and fine structures, where its processing efficiency and precision are superior.
Industry | Processing Procedures and Required Processes |
MPCVD Raw Material Stage | Coring |
Slice | |
Double-sided cutting | |
Shaving mode | |
Jewelry | Cutting |
4P | |
Alien 4P | |
2D Rough machining of arbitrary structure | |
Industrial Heat Dissipation Substrate | Polishing |
Large size cutting (2 inches, 4 inches, or even larger sizes) | |
Special-shaped 2D cutting, drilling | |
Industrial Cutting Tools | 2D and 3D rough machining of arbitrary structures |
Wire Drawing Die | 2D and 3D rough machining of arbitrary structures |
Round drill 4P Special-shaped coring
Face trimming and slicing
Single-sided and double-sided cutting Special-shaped 4P
Diamond processing method:
Traditional Processing Challenges:Due to its extreme hardness, traditional cutting methods are inefficient.
Advantages of Laser Processing:Using the instant high-temperature action of the laser, high-efficiency, and high-precision processing can be achieved.
Processing Technology:From core extraction, slicing to applications across various industries, laser processing provides diamond with broader possibilities.
02 Challenges in Diamond Laser Production and Processing
Diamond, as a material, faces a series of challenges in industrial production when processed using lasers. While diamond has extreme hardness and excellent thermal conductivity, processing it remains difficult.
Difficulties and Challenges in Diamond Applications | The Current Difficulties in Laser Processing | Section roughness < 100nm | |
Four angle deviation value < 10um | |||
10 × 10 cutting loss < 200um | |||
10 × 10 cutting time < 30min | |||
Cutting texture without obvious horizontal stripes | |||
High power cutting diamond easy to crack | |||
Special-shaped 4p machining efficiency is low | |||
Large size wafer core easy to crack | |||
4p machining deviation < 100um | |||
30 × 30 large size loss within 500um | |||
Difficulties in the Industry | Large size diamond wafer processing difficulty | Laser thinning | |
Laser stealth | |||
Long diamond polishing time | Laser polishing Sa < 100um | ||
Laser polishing efficiency is about 600um/h | |||
Laser Difficulties | Single pulse high energy | ||
Long-term stability |
In conclusion, diamond laser industrial production and processing face many challenges, requiring constant exploration and innovation to improve processing efficiency, reduce costs, and ensure processing quality and safety, thereby enabling the widespread application of diamond in industrial fields.
INNO LASER Diamond Cut Series
Based on the original AWAVE technology platform, the upgraded FORMULA series lasers exhibit exceptional optical performance. It maintains the original leading beam quality (M2 < 1.2) and the laser's working frequency range (5kHz - 50kHz). Additionally, it optimizes the laser's power at high repetition frequencies, enabling the laser to meet more application demands and improve customer processing efficiency.
Reliable Power Stability
Superior Beam Quality
Performance and Stability
Efficient In-Cavity Frequency Doubling Technology
Meets 7*24 Industrial Production Requirements
Supports TTL/PWM Signal Control
01 Modular, Compact Size
Achieve a more compact cutting equipment with the highest land utilization; seamless switching or direct replacement of the original side-pumped laser system.
02 Excellent Beam Quality
Compared to traditional side-pumped systems, it offers better stable beam quality, achieving better surface quality and smaller cuts.
03 Efficient and Energy-Saving Laser System
Using highly efficient DPSS end-pump technology, the optical-to-optical conversion efficiency is improved from 35% to 60%, doubling the energy savings compared to traditional side-pump lasers.
04 Leading Technological Solution
The advanced DPSS end-pump technology offers superior beam quality, high efficiency, low power consumption, and long-term reliability.
*INNO Laser is a highly trusted and closely partnered laser supplier for ARGUS laser marking equipment.
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