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Laser Revolutionizes Precision Manufacturing with Advanced Laser Selective Stripping Technology

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Laser Revolutionizes Precision Manufacturing with Advanced Laser Selective Stripping Technology

What is Laser Stripping?

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Stripping is an essential step in many applications, involving the effective removal of outer layers of material, such as insulation on wires or surface coatings, to expose the underlying material. This process is crucial for ensuring proper electrical conductivity, enhancing adhesion in subsequent coating processes, or achieving precise measurements in analytical techniques. Stripping typically serves as an important preparatory step before further processing or application. As a foundational process technology, it has become widely adopted in various industries, including electronics and automotive sectors.

Industry Applications and Descriptions

Industry Application Description
Electronics Industry Removes insulation layers from wires or cables to expose conductive components, facilitating soldering or adhesive bonding.
Medical Equipment Strips insulation from wires or cables in devices such as guidewires or implantable assemblies. This process enables precise stripping without damaging underlying components.
Semiconductor Industry Removes photoresist or other coatings during wafer fabrication. This process helps achieve high-resolution patterns and precise removal of unnecessary materials.
Machinery Industry Strips coatings, paint, or adhesives from engine parts and other mechanical components. This process supports reconditioning or reuse of parts while ensuring accurate and clean stripping without damaging the underlying base materials.

Laser selective stripping differs from mechanical contact stripping in that it is a non-contact process, offering a clean, precise, and efficient method for removing specific layers or areas of material. This makes it a valuable technique in industries where precision and control are critical, particularly for thin substrates and wires.


Laser Selective Stripping Technology


Due to its non-contact nature, a focused laser beam can be precisely directed to the target area according to design specifications to selectively remove surface coatings. This flexibility makes the process suitable for workpieces of various sizes, shapes, thicknesses, and material types.

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As mentioned earlier, the essence of laser selective stripping lies in completely removing the coating while preserving the integrity of the substrate. Therefore, the choice of laser source is critical in this process.

Laser Type Application Description
ns-IR/GN Laser Selectively removes coatings and adhesives from thick metal substrates.
ns-UV Laser Selectively removes polymer coatings from various substrates (such as metal, plastic, and ceramic).
ps-IR/GN Laser Precisely peels transparent coatings from semiconductor substrates, achieving pinpoint accuracy.
fs-IR/GN Laser Precisely removes polymer coatings from dense metal substrates while maintaining strict quality and precision standards.


INNO Laser*

The short-pulse FORMULA high-power UV nanosecond laser from INNO Laser* offers a cost-effective solution for selectively removing polymer coatings while minimizing damage to the surrounding areas and underlying substrate.

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When customers require a stripping process that does not damage the surrounding and underlying substrate, ultrafast lasers are a more suitable choice. INNO Laser offers ultrafast lasers such as the UV picosecond AMT series and the green femtosecond AOFEMTO series.

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The image above shows the introduction and curve diagram for picosecond lasers, while the image below provides the introduction and curve diagram for femtosecond lasers.


*INNO Laser is a highly trusted and closely partnered laser supplier for ARGUS laser marking equipment.


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