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LT-7130
ARGUS
1.Laser System
l Laser Wavelength:1064nm
l Laser Average Power:10W(TEM00)
l Classical Spot Size: 35-50µm
l Focusing Method: Controlled by PC program
2.Laser Beam Locating System
l Laser beam Motion Range:60mm X 60mm
l Motion Resolution:5µm
l Repeated Positioning Precision:1µm
l Max. Scanning Speed:5000mm/s
3.Graphic Monitor System
l Monitor Mode:Laser Coaxial Monitor
l Proprietary technology: achromatic technology, wide laser, coincidence imaging
l Monitoring field:4-6mm(diagonal)
l Lighting source: LED lighting
4.Measurement System
l Resistor measure method:Current measurement method
l Measurement Range: 1Ω-10MΩ(16bit Resolution)
l Measurement accuracy.
0.1Ω< Rx < 100Ω ±0.05% + 0.5% / Rx
100Ω< Rx < 100KΩ ±0.05%
100KΩ< Rx < 100MΩ ±0.05% + 0.05% * Rx
l Measurement Speed:25µs
l Resolution of DC voltage:0.16µV(Full Scale of 10mV)
l Probe Card:42 lines, arbitrarily defined
l Motion of Probe Card:Computer Program Control
5.Computer & Software System
l Control Computer Dual Processor,19 Inch LCD
l Operation System:Windows XP
6.Step Repeated Motion System
l Motion Method:Precision screw and double linear guide
l Motion Range:300mm*300mm
l Max Ceramic Plane Size:150mm*150mm
l Motion Resolution:1µm
l Repeated Positioning Precision:±5µm
l Position Precision: ±50µm
l Max Speed:120mm/s(carrying idler)
7.Other technical indicators
l External control: standard 4-way program-controlled switch, expandable
l Cooling system:Air-cooling
l Supply voltage:220V AC Pressure:<0.4MPa Total power consumption:2500W
1.Laser System
l Laser Wavelength:1064nm
l Laser Average Power:10W(TEM00)
l Classical Spot Size: 35-50µm
l Focusing Method: Controlled by PC program
2.Laser Beam Locating System
l Laser beam Motion Range:60mm X 60mm
l Motion Resolution:5µm
l Repeated Positioning Precision:1µm
l Max. Scanning Speed:5000mm/s
3.Graphic Monitor System
l Monitor Mode:Laser Coaxial Monitor
l Proprietary technology: achromatic technology, wide laser, coincidence imaging
l Monitoring field:4-6mm(diagonal)
l Lighting source: LED lighting
4.Measurement System
l Resistor measure method:Current measurement method
l Measurement Range: 1Ω-10MΩ(16bit Resolution)
l Measurement accuracy.
0.1Ω< Rx < 100Ω ±0.05% + 0.5% / Rx
100Ω< Rx < 100KΩ ±0.05%
100KΩ< Rx < 100MΩ ±0.05% + 0.05% * Rx
l Measurement Speed:25µs
l Resolution of DC voltage:0.16µV(Full Scale of 10mV)
l Probe Card:42 lines, arbitrarily defined
l Motion of Probe Card:Computer Program Control
5.Computer & Software System
l Control Computer Dual Processor,19 Inch LCD
l Operation System:Windows XP
6.Step Repeated Motion System
l Motion Method:Precision screw and double linear guide
l Motion Range:300mm*300mm
l Max Ceramic Plane Size:150mm*150mm
l Motion Resolution:1µm
l Repeated Positioning Precision:±5µm
l Position Precision: ±50µm
l Max Speed:120mm/s(carrying idler)
7.Other technical indicators
l External control: standard 4-way program-controlled switch, expandable
l Cooling system:Air-cooling
l Supply voltage:220V AC Pressure:<0.4MPa Total power consumption:2500W
Number | Name | Specifications | Quantity | Origin or Brand |
1 | Diode end-pumped solid-state laser |
6W/10KHz |
1 | Domestic assembly, Imported core components |
2 | Scanning galvanometer | ¢10mm | 1 | Domestic assembly |
3 | Step Repeated System | 300mm*300mm | 1 | HIWIN |
4 | Power | 1 | MEANWELL | |
5 | CCD coaxial monitoring | Achromatic lens | 1 | ARGUS |
6 | Control System | 1 | ARGUS | |
7 | Special software system | 1 | ARGUS | |
8 | industrial control computer | 1 | ADLINK | |
9 | Working platform | Micro - processing of granite | 1 | ARGUS |
10 | Accessories | Dust cleaning device | 1 | ARGUS |
1. Laser System
Advantage: Compact Structure, Air Cooling, High Efficiency and Reliability
“Light knife” can realize the cutting of resistors, and can be used to cut the thick or thin-film circuit resistance. The machine adopts fiber lasers which are originally imported and be advanced in the world today. And the incision has excellent quality.
2. Laser Position System
It is used to realize the controlling of the laser positioning and trajectory. Control the beams at the position in the X and Y directions. Shorten the time of locating, repairing and adjusting. It has high efficiency, high speed and high precision.
Number | Name | Specifications | Quantity | Origin or Brand |
1 | Diode end-pumped solid-state laser |
6W/10KHz |
1 | Domestic assembly, Imported core components |
2 | Scanning galvanometer | ¢10mm | 1 | Domestic assembly |
3 | Step Repeated System | 300mm*300mm | 1 | HIWIN |
4 | Power | 1 | MEANWELL | |
5 | CCD coaxial monitoring | Achromatic lens | 1 | ARGUS |
6 | Control System | 1 | ARGUS | |
7 | Special software system | 1 | ARGUS | |
8 | industrial control computer | 1 | ADLINK | |
9 | Working platform | Micro - processing of granite | 1 | ARGUS |
10 | Accessories | Dust cleaning device | 1 | ARGUS |
1. Laser System
Advantage: Compact Structure, Air Cooling, High Efficiency and Reliability
“Light knife” can realize the cutting of resistors, and can be used to cut the thick or thin-film circuit resistance. The machine adopts fiber lasers which are originally imported and be advanced in the world today. And the incision has excellent quality.
2. Laser Position System
It is used to realize the controlling of the laser positioning and trajectory. Control the beams at the position in the X and Y directions. Shorten the time of locating, repairing and adjusting. It has high efficiency, high speed and high precision.
Trimming Methods
The machine is capable with various trimming methods, besides the standard ways of Plunge trimming, L trimming, U trimming and etc, also can be customized according to customer’s requirement. Such as Symmetrical and scanning trimming.
Plunge Trimming: For square thick film resistors, high speed, normal precision;
Double Plunge: For square thick film resistors, high precision;
L Trimming: For rectangular thick film resistor trimming, high precision;
U Trimming: For power output trimming of thick film resistors, general precision
Double U Trimming: Specially designed for customized thick film resistors;
Serpentine Trimming: multiply combination by arbitrarily trimming mode ;
Trimming Methods
The machine is capable with various trimming methods, besides the standard ways of Plunge trimming, L trimming, U trimming and etc, also can be customized according to customer’s requirement. Such as Symmetrical and scanning trimming.
Plunge Trimming: For square thick film resistors, high speed, normal precision;
Double Plunge: For square thick film resistors, high precision;
L Trimming: For rectangular thick film resistor trimming, high precision;
U Trimming: For power output trimming of thick film resistors, general precision
Double U Trimming: Specially designed for customized thick film resistors;
Serpentine Trimming: multiply combination by arbitrarily trimming mode ;